研磨装置

Polishing device

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing device in which fixed abrasive grains for achieving high machining accuracy are used. <P>SOLUTION: This polishing device for polishing the surface to be worked of a workpiece includes a surface plate rotated about a first rotating axis, a porous grinding wheel which is attached to the upper surface of the surface plate, on which a working surface brought into contact with the surface to be worked of the workpiece is formed, and which comprises abrasive grains, a binder, and pores, a holding part which is rotated about a second rotating axis displaced from the first rotating axis and holds a plurality of workpieces while allowing the porous grinding wheel and the workpiece to slide relative to each other with the machining surface of the porous grinding wheel on the surface plate brought into contact with the surface to be worked of the workpiece, a fluid passage for flowing water which is formed in the surface plate, which is opened to the upper surface of the surface plate, and which communicates with the working surface of the porous grinding wheel through the pores of the porous grinding wheel, a pump which is connected to the fluid passage for flowing water and which supplies pressurized water to the fluid passage for flowing water, and a control unit which operates the pump when detecting a stop signal for stopping the rotation of the surface plate and the holding part to discharge the water supplied from the pump to the working surface through the fluid passage for flowing water and the pores. <P>COPYRIGHT: (C)2011,JPO&INPIT
【課題】 高い加工精度を実現する固定砥粒を用いた研磨装置を提供する。 【解決手段】 被加工物の被加工面を研磨する研磨装置は、第1の回転軸を中心に回転する定盤と、定盤の上面に取り付けられ、被加工物の被加工面と接触する加工面が設けられ、砥粒、結合材及び気孔を有する多孔質砥石と、第1の回転軸とずれた第2の回転軸を中心に回転し、定盤上の多孔質砥石の加工面と被加工物の被加工面を接触させた状態で多孔質砥石と被加工物とを相対的に摺動させながら複数の被加工物を保持する保持部と、定盤に形成され且つ定盤の上面に開口し、多孔質砥石の気孔を介して多孔質砥石の加工面と連通する通水用流体通路と、通水用流体通路と接続し、通水用流体通路に加圧された水を供給するポンプと、定盤と保持部の回転を停止させる停止信号を検出すると、ポンプを作動させ、ポンプから供給された水を通水用流体通路、さらには気孔を介して加工面に吐出させる制御部とを備える。 【選択図】図4

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Cited By (3)

    Publication numberPublication dateAssigneeTitle
    JP-2014100772-AJune 05, 2014Disco Abrasive Syst Ltd, 株式会社ディスコ研削装置
    JP-2014200868-AOctober 27, 2014株式会社ナノテム, Nanotemu:KkPolishing device
    JP-2015104762-AJune 08, 2015株式会社ナノテム, Nanotemu:Kk砥石およびそれを用いる研削装置